Title: Strandboard made from soy-based adhesive with high soy content
Author: Cai, Zhiyong; Wescott, James M.; Winandy, Jerrold E.
Source: Wood adhesives 2005 : November 2-4, 2005 ... San Diego, California, USA. Madison, WI : Forest Products Society, 2005: pages 531-537.
Description: A novel green adhesive with high soy content has recently been developed (13) with a process that denatures soy flour, modifies resulting protein with formaldehyde, and uses suitable phenolic crosslinking agents for copolymerization. Compared with mechanical and physical performances of oriented strandboard, the new adhesive showed promise for improving panel performances and lowering costs. We studied the effects of four variables (face-resin content, face-furnish moisture content [MC], density of the panels, and press time) on panel performances and identified possible interactions with each variable. The results indicated that increasing face-resin content and density would improve mechanical bending performance. This soy-based phenol-formaldehyde (PF) also somewhat reduced the thickness swelling and water soak absorption. Face-furnish MC had no effect on tested properties, but it significantly enhanced heat transfer (core temperature and internal steam pressure) during the press process. Under a press temperature of 215°C, a closed press time of 150 seconds was not sufficient to fully cure the new soy-PF face resin, and further investigation is recommended to optimize press process (press time and face-furnish MC) and resin performance.
Keywords: Absorption, moisture, wood density, particle board, adhesives, soybean glue, formaldehyde, phenolic resins, soy flour, swelling, bending strength, panels, density, moisture content, phenolic adhesives, phenolic resin glue, bonding, OSB, oriented strandboard
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Cai, Zhiyong; Wescott, James M.; Winandy, Jerrold E. 2005. Strandboard made from soy-based adhesive with high soy content. Wood adhesives 2005 : November 2-4, 2005 ... San Diego, California, USA. Madison, WI : Forest Products Society, 2005: pages 531-537.
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