Title: High-temperature performance of soy adhesives
Author: Hunt, Christopher G.; O’Dell, Jane L.; Frihart, Charles R.
Source: Wood Adhesives 2009 [electronic resource]. FPS proceedings no. 7216-09. Madison, WI : Forest Products Society, c2010 [1 CD-ROM]: p. 214-219: ISBN: 9781892529572: 1892529572.
Description: We investigated the likelihood of soybean-based adhesives passing the heat resistance requirement for structural adhesives. We evaluated the performance of soy adhesives up to a temperature of 230°C using ASTM 7247 (hot and cold shear blocks), thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), and dynamic mechanical analysis (DMA). We found that pure soy flour performed relatively well at high temperature, and the addition of crosslinking agents generally improved performance. One commercial soy/phenol formaldehyde passed the standard test ASTM D7247.
Keywords: Soy flour, adhesives, testing, soybean glue, adhesion, glue, crosslinking, polymerization, soy proteins, phenols, thermal analysis, fire testing, composite materials, thermal properties, proteins, formaldehyde, temperature, thermogravimetry, calorimetry, high temperature, bonding, gluing, failure, durability, thermal degradation, fire resistance, fire hazard, ASTM standard D7247, flammability, dynamic mechanical analysis
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Hunt, Christopher G.; O’Dell, Jane L.; Frihart, Charles R. 2010. High-temperature performance of soy adhesives. Wood Adhesives 2009 [electronic resource]. FPS proceedings no. 7216-09. Madison, WI : Forest Products Society, c2010 [1 CD-ROM]: p. 214-219: ISBN: 9781892529572: 1892529572.
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